Recording the integrated circuit decapsulation process

The Adafruit Blog is documenting an IC decapsulation video—the process of removing a microchip's protective casing to expose the silicon die. Using a hot air gun set to around one hundred fifty degrees Celsius, the method works cleanly on smaller components, though larger dies often require boiling in rosin to remove residual compound. Proper safety equipment—eye protection and careful tool handling—is essential.

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